At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible.

At our core, Western Digital is a company of problem solvers. People achieve extraordinary things given the right technology. For decades, we’ve been doing just that. Our technology helped people put a man on the moon.

We are a key partner to some of the largest and highest growth organizations in the world. From energizing the most competitive gaming platforms, to enabling systems to make cities safer and cars smarter and more connected, to powering the data centers behind many of the world’s biggest companies and public cloud, Western Digital is fueling a brighter, smarter future.

Binge-watch any shows, use social media or shop online lately? You’ll find Western Digital supporting the storage infrastructure behind many of these platforms. And, that flash memory card that captures and preserves your most precious moments? That’s us, too.

We offer an expansive portfolio of technologies, storage devices and platforms for business and consumers alike. Our data-centric solutions are comprised of the Western Digital®, G-Technology™, SanDisk® and WD® brands.

Today’s exceptional challenges require your unique skills. It’s You & Western Digital. Together, we’re the next BIG thing in data.

• Maximize wire bond process capability to handle wide range of product portfolio.
• Drive for Wire Bond process yield improvement and monitoring.
• Drive for Wire Bond related test QDN investigation and improvement plan.
• Support in mold process improvement projects.
• Hand-sake with NPI team on new technology / product / wire bond methodology transfer to mass production.
• Liaise and work with equipment team on equipment related improvement and new machine qualification.
• Project management in project related to wire bond yield improvement, cost saving and process efficiency.

1) Bachelor's degree in Mechanical/ Electrical / Electronics /Microelectronics / Mechatronics / Materials Science / Semiconductor Technology or any related science and engineering discipline.

2) At least 5 years related experience in Semiconductor wire bond process or any process engineering background. 

3) Statistical data analysis, analytical and problem solving skills. 

4) Ability to anticipate issues and challenges and resolving them quickly. 

5) Expert in prosses knowledge and skills in manufacturing process & some equipment knowledge.  

6) Able to communicate with different level of staffs.

Western Digital thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Western Digital is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at  to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

NOTICE TO CANDIDATES: Western Digital has received reports of scams where a payment is requested on Western Digital’s behalf as a condition for receiving an offer of employment. Please be aware that Western Digital and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to compliance@wdc.com.